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IT Materials & Components Research Division

As global supply chain disruptions continue to reshape industrial competitiveness, the focus has expanded beyond finished products to encompass the critical materials and components that underpin industries ranging from traditional manufacturing to advanced sectors such as semiconductors and batteries.

The IT Materials & Components Research Division develops advanced materials and component technologies that address emerging industrial demands and support a wide range of sectors, including semiconductors, mobility, batteries, electronic components, telecommunications, quantum technologies, aerospace, and defense. Our research spans next-generation batteries and key materials and components, 6G and low-Earth-orbit (LEO) satellite communication components, advanced packaging technologies for next-generation semiconductors, quantum materials, parts and equipment technologies, defense applications, and convergent electronic materials and nanotechnology.

In addition, we provide comprehensive support to industry through our specialized infrastructure for semiconductor and battery materials and components, as well as our product reliability evaluation facilities. As a nationally accredited testing laboratory under the Korea Laboratory Accreditation Scheme (KOLAS), we help companies improve the reliability and quality of their electronic products through systematic testing, evaluation, and identification of technical weaknesses, enabling continuous product enhancement and commercialization.

Moving forward, we will continue to go beyond technological development by creating new value through customized materials and component technologies tailored to the evolving needs of future advanced industries.

Song, Junho, Vice President of IT Materials & Components Research Division

ICT Device/Packaging Research Center

  • GaN/InP device, modeling, components
  • RFIC for communications/radar
  • Wireless/Satellite communication and radio application components
    (Antenna, RF filter, Beamformer, FEM, RF modules, Meta-surface, etc.)
  • 5G/6G RF components and O-RU technology
  • Low loss packaging materials for mmWave and high speed application
  • mmWave and 2.5D fanout packaging
  • Quasi-, Interposer-MMIC power amplifier technology
  • Package signal and power integrity analysis
  • 4D-image and synthetic aperture radar components AiP(Antenna-in-Packaging) / AoP(Antenna-on-Packaging) technology
  • System-in-Packaging/System-on-Packaging/System-on-Module technology

Electronic Convergence Materials & Device Research Center

  • Space compliant 3D printing composite materials
  • Large scale/ fast ALD process and applications for Semiconductor
  • Smart window functional materials for Future mobility
  • Package technology for Future mobility/ Module connection material & process
  • Piezo-materials and component manufacturing for Future mobility
  • Future New industry demand oriented ceramic materials and process
  • Future New industry demand oriented composite materials and process
  • Future New industry demand oriented metal interconnection materials and process
  • Thin film materials and process for Advanced Manufacturing
  • Advanced packaging materials for Semiconductor
  • EUV semiconductor materials and component manufacturing
  • Semiconductor packaging materials for aerospace and military applications
  • 6G communication material & component manufacturing technology & evaluation platform
  • Next generation communication EMI shielding/absortption material & analysis platform

ICT Nano Convergence Technology Research Center

  • CNT materials and functional composite
  • Graphene materials, devices, processes and applications
  • Silver nanowire flexible electronics and applications
  • Conductive ink/paste materials for electrode applications
  • Printed electronics and additive manufacturing
  • Heating materials, TIM, thermal managing materials and components
  • Organic/inorganic hybrid chip bonding materials for semiconductor
  • Nanohybrid materials and environmental applications
  • Highly functional thin film coating
  • Optical device & laser application
  • MEMS sensors and actuators
  • Sensor ROIC & High Voltage driver IC
  • Advanced manufacturing and process monitoring

Reliability Research Center

  • Thermal solution (test/measurement/analysis)
  • RF/EMC solution (test/measurement/analysis)
  • Power semiconductor lifetime evaluation
  • Power semiconductor solution (test/measurement/analysis)
  • Reliability evaluation of electronic components in Aerospace
  • Computer aided engineering (Thermal/stress/EMC)
  • Reliability prediction (MIL 217+)
  • Reliability testing (KS, MIL, AEC-Q)
  • Accelerated life testing (ALT, HALT)
  • Failure analysis and aaterials reverse engineering
  • Integrated electron microscopy analysis
  • Material analysis under extreme condition
  • PHM (Prognosis & health monitoring)

Next-Generation Battery Research Center

  • Cathode and anode materials for high-capacity/high-power lithium-ion secondary batteries for EVs
  • Solid electrolyte materials and all-solid-state batteries
  • High-energy-density next-generation batteries utilizing lithium metal
  • Redox Flow Batteries for power storage applications
  • Secondary batteries based on SO₂ inorganic electrolytes
  • Materials for lithium-ion capacitors
  • Advanced analysis technologies for secondary battery materials and components
  • Technologies for the reuse, repurposing, and recycling of used secondary batteries
  • Water electrolysis materials and water electrolysis cells
  • Technologies for securing the long-term stability of water electrolysis stacks
  • Silicon/perovskite solar cell module technologies
  • Solar cell module technologies capable of reducing carbon emissions