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IT Materials & Components Research Division

The key to global technology competitiveness is shifting to materials and components with global standardization of assembling·processing technology of end products. The IT Materials & Components R&D Division is developing core technologies that are required in all industries including telecommunications, semiconductor, electronics, aerospace, energy, military defense and automobile as the advanced materials and components technology that enables to respond to future industry demand in the 4th industrial revolution era. We have been especially dedicated to research and development of 5G/6G communication components, advanced packages, military applications along with nano converging technology and convergence·complex technologies for electronic material. As a designated testing institution by Korea Laboratory Accreditation Sheme(KOLAS), we are also developing reliability technique to improve reliability and quality of electronic components, providing systematic support for the testing, evaluation and improvement of product venerability produced by SMEs and business ventures. We promise to create a new market through materials & components development that responds to industry demand.

Ahn, Kwang Ho, Vice President of IT Materials & Components Research Division

ICT Device/Packaging Research Center

  • GaN/InP device, modeling, components
  • RFIC for communications/radar
  • Wireless/Satellite communication and radio application components
    (Antenna, RF filter, Beamformer, FEM, RF modules, Meta-surface, etc.)
  • 5G/6G RF components and O-RU technology
  • Low loss packaging materials for mmWave and high speed application
  • mmWave and 2.5D fanout packaging
  • Quasi-, Interposer-MMIC power amplifier technology
  • Package signal and power integrity analysis
  • 4D-image and synthetic aperture radar components AiP(Antenna-in-Packaging) / AoP(Antenna-on-Packaging) technology
  • System-in-Packaging/System-on-Packaging/System-on-Module technology

Electronic Convergence Materials & Device Research Center

  • Space compliant 3D printing composite materials
  • Large scale/ fast ALD process and applications for Semiconductor
  • Smart window functional materials for Future mobility
  • Package technology for Future mobility/ Module connection material & process
  • Piezo-materials and component manufacturing for Future mobility
  • Future New industry demand oriented ceramic materials and process
  • Future New industry demand oriented composite materials and process
  • Future New industry demand oriented metal interconnection materials and process
  • Thin film materials and process for Advanced Manufacturing
  • Advanced packaging materials for Semiconductor
  • EUV semiconductor materials and component manufacturing
  • Semiconductor packaging materials for aerospace and military applications
  • 6G communication material & component manufacturing technology & evaluation platform
  • Next generation communication EMI shielding/absortption material & analysis platform

ICT Nano Convergence Technology Research Center

  • CNT materials and functional composite
  • Graphene materials, devices, processes and applications
  • Silver nanowire flexible electronics and applications
  • Conductive ink/paste materials for electrode applications
  • Printed electronics and additive manufacturing
  • Heating materials, TIM, thermal managing materials and components
  • Organic/inorganic hybrid chip bonding materials for semiconductor
  • Nanohybrid materials and environmental applications
  • Highly functional thin film coating
  • Optical device & laser application
  • MEMS sensors and actuators
  • Sensor ROIC & High Voltage driver IC
  • Advanced manufacturing and process monitoring

Reliability Research Center

  • Thermal solution (test/measurement/analysis)
  • RF/EMC solution (test/measurement/analysis)
  • Power semiconductor lifetime evaluation
  • Power semiconductor solution (test/measurement/analysis)
  • Reliability evaluation of electronic components in Aerospace
  • Computer aided engineering (Thermal/stress/EMC)
  • Reliability prediction (MIL 217+)
  • Reliability testing (KS, MIL, AEC-Q)
  • Accelerated life testing (ALT, HALT)
  • Failure analysis and aaterials reverse engineering
  • Integrated electron microscopy analysis
  • Material analysis under extreme condition
  • PHM (Prognosis & health monitoring)